Light emission diode

ABSTRACT

A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

BACKGROUND OF THE INVENTION

(a) Field of the Invention

The present invention is related to a light emitting diode (LED), andmore particularly, to one that is capable of helping secure the casingin relation to the frame and improving heat sink effects.

(b) Description of the Prior Art

Whereas a light emitting diode is related to a light emitting devicecomprised of semi-conductor that produces spectra of different frequencyby emitting photons as a result of having the electrons incorporatedwith electron holes in the semiconductor crystal. That is, when a lightemitting chip of integrated n-type semiconductor crystal and p-typesemiconductor crystal conducts, extra electrons from the n-typesemiconductor crystal will flow into the electron holes in the p-typesemiconductor crystal; and energy is released when electrons from then-type conductor crystal flow into electron holes in the p-typesemiconductor crystal due to differences in potentials. The energy isreleased in the form of light to produce streams of light indifferentwavelengths.

As illustrated in FIG. 1 of the accompanying drawing showing a basicconfiguration of a light emitting diode generally available in themarket, the light emitting diode 1 is provided with a frame 11; theframe 11 is separately disposed with two carriers 111; a light-emittingchip 12 is fixed to one carrier 111 with conductive or non-conductivefilm or in eutectic fashion before having a golden plated wire 13 (orany conductor providing the equivalent conductive function) to connectthe light emitting chip 12 and each carrier 111 so to apply differentvoltages between two frames for creating two carriers 111 respectivelycarrying positive and negative electrodes for releasing energy to emitlight through a combination of electrons and electron holes.

However, as illustrated in FIG. 2, in molding the frame 11, two carriers111 corresponding to each other without connection are punched on astraight and flush metal material band, followed with the formation of aplastic casing 14 by injection within the area defined by both carriers111, and a section for multiple pins 15 with each in a given shape arepunched on the section of the plastic casing 14 extending from thecarrier 111. Then one or a plurality of punching cores is provided tocause the section of pins 15 to bend toward a pre-determined positioncorresponding to the plastic casing 14 to become an integralconstruction of multiple pins 15 for the carrier 111 to secure the lightemitting chip and to fill fluorescent material or packaging materialinto the plastic casing 14 of the light emitting frame.

Nonetheless, the frame 11 is related to a straight and flush structureand when the plastic casing 14 is formed on the area of two carriers111, the positioning effect by contact between the plastic casing andthe frame 11 is comprised of two straight and flush contact planesresulting in poor positioning effect since both of the frame 11 and theplastic casing 14 are vulnerable to separating from each other.Furthermore, as the light emitting diode 12 of the light emitting diodeis functioning, the heat produced fails to be effectively dissipated Inturn, the temperature of the entire LED can keep on rising until the LEDfails.

SUMMARY OF THE INVENTION

The primary purpose of the present invention is to provide an improvedconstruction of a light emitting diode to correct the problem of thedefects of the prior art by helping secure the casing in relation to theframe and improving heat sink effects.

To achieve the purpose, the present invention includes a casing, a framein the casing, one or a plurality of light emitting chips, and apackaging polymer; the frame provides a placement area to receive thelight emitting chip, and an electrode area separated from the placementarea; and a step portion is disposed at where appropriately on theplacement area to increase the contact area between the casing and theframe while improving the stability of relative positioning between thecasing and the frame.

Furthermore, the placement area is in a thickness greater than that ofthe electrode area, and an opening is provided at the bottom of anaccommodation recess in relation to the placement area to expose thebottom of the placement area out of the casing; so that when the lightemitting chip is placed on the placement area, the placement areaabsorbs the heat generated by the light emitting chip during itsoperation. The heat absorption and dissipation effects executed by themetallic material will dissipate the heat through the opening thus forthe light emitting diode to maintain its working temperature withoutbeing damaged due to overheating.

Another purpose of the present invention of an improved structure of alight emitting diode is to allow both of the placement area and theelectrode area to extend to the outer side of the casing through theaccommodation recess. To achieve the purpose, the light emitting diodealso contains the casing, the frame in the casing, one or a plurality oflight emitting chip, and the packaging polymer; the frame is providedwith the placement area to receive the light emitting chip; theelectrode area separate from the placement area; a protruding portionoutwardly extends from the side of the placement area; a supportingportion outwardly extends from the side of the electrode area; and bothof the protruding portion and the supporting portions allow theplacement area and the electrode area to extend from the accommodationrecess to the outer side of the casing.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a construction of a light emittingdiode of the prior art.

FIG. 2 is a schematic view showing the construction of the lightemitting diode of the prior art.

FIG. 3 is a perspective view of a light emitting diode of the presentinvention.

FIG. 4 is a schematic view showing a layout of frame and light emittingchip in the present invention.

FIG. 5 is another perspective view of the light emitting diode of thepresent invention.

FIGS. 6(A) and 6(B) are sectional views showing a construction of thelight emitting diode of the present invention.

FIG. 7 is another schematic view showing a layout of the frame and thelight-emitting chip of the present invention.

FIG. 8 is a perspective view showing a frame and a metallic materialband in another preferred embodiment of the present invention.

FIG. 9 is a perspective view showing a construction of another preferredembodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 3, 4, and 5 for a preferred embodiment of the presentinvention, a light emitting diode 2 includes a casing 21 containing aframe 22 and the casing is provided with an accommodation recess 211 toexpose the frame 22.

The frame 22 is provided with a placement area 221 to receive alight-emitting chip 23, and an electrode area 222 separate from theplacement area 221. A step portion area 223 is disposed appropriately onthe placement area 221. As illustrated, the step portion 223 is disposedat the bottom of the placement area 221. A protruding portion 224extends from one side of the placement area 221 so that the side of theplacement area becomes a non-flush structure. The electrode area 222 iscomprised of one or a plurality of pair of positive and negativeelectrode areas 2221, 2222 that are separated from each other bypolarity.

One or a plurality of light emitting chips 23 is placed on the placementarea 221 and electrically connected respectively to the positive andnegative electrode areas 2221, 2222 by means of a conductor 24. Apackaging polymer 25 is disposed in the accommodation recess 211.

The frame 22 is comprised of the placement area 221 and the electrodearea 222 with both areas each molded with a metallic material band. Thestep portion 223 is formed at the bottom of the placement area 221. Alsoreferring to FIG. 6(A), the protruding portion 224 extends from one sideof the placement area 221 so that the side of the placement area becomesa non-flush structure. When the casing 21 is molded on the frame, thestep portion 223 and the protruding portion 224 increase the contactarea between the casing 21 and the frame 22 and helps prevent both ofthe casing 21 and the frame 22 from being separated from each other.

Furthermore, the thickness of the placement area 221 is greater thanthat of the electrode area 222 as illustrated in FIG. 6(A). An opening212 is formed on the bottom of the accommodation recess 211 in relationto the placement area 221 so to expose the bottom of the placement areaout of the bottom of the casing 21 while the bottom of the placementarea 221 and the bottom of the casing 21 are on the same plane. When thelight emitting chip 23 is placed on the placement area 221, theplacement area 221 absorbs the heat generated by the light-emitting chip23 during its operation. The heat is dissipated from the placement area221 where the opening 212 is disposed due to the heat absorption anddissipation effects provided by the metallic material for the lightemitting diode 2 to maintain its working temperature without beingdamaged due to overheating. Of course, the bottom of the placement area221 may also slightly protrude from the bottom of the casing 21 asillustrated in FIG. 5.

The electrode area 222 may be related to one or a plurality of pair ofpositive and negative electrode areas with both areas separated fromeach other by polarity. As illustrated in FIG. 7, two sets of positiveand negative electrode areas 2221, 2222 are provided in the electrodearea 222 with both positive and negative electrode areas 2221, 2222being separated from each other by polarity.

As illustrated in FIG. 8 for another preferred embodiment of the presentinvention, the light emitting diode 2 also contains a casing 21(represented by dotted line), the frame 22 in the casing 21, one or aplurality of light emitting chip 23, and the packaging polymer 25. Theframe is comprised of the placement area 221 for placing thelight-emitting chip 23 thereon, and the electrode area 222 that isseparated from the placement area 221 with both areas 221, 222 made of ametallic material band 3. The protruding area 224 outwardly extends fromone side of the placement area 221 and a supporting portion 225outwardly extends from one side of the electrode area 222. Thesupporting portion 225 connects the frame 22 and the metallic materialband 3.

When the frame 22 is molded on the casing 21, the frame is held inposition by means of the connection between the supporting portion 225and the metallic material band 3 so to secure the relative positioningbetween the casing 21 and the frame 22. After the casing is molded, theframe 22 is separated from the metallic material band 3 to complete theconstruction of the light emitting diode as illustrated in FIG. 9 withthe protruding portion 224 and the supporting portion 225 exposed out ofthe surface of the casing 21 to serve as a connecting point in thesubsequent process.

As illustrated in FIG. 7, the electrode area 222 is comprised of one ora plurality of paired positive and negative electrode areas 2221, 2222with both areas separated from each other by polarity. Two sets of thepaired positive and negative electrode areas 2221, 2222 are provided inthe preferred embodiment as illustrated. The supporting portion 225outwardly extends from one side of each of the positive and negativeelectrode areas 2221, 2222; and the protruding portion 224 outwardlyextends from one side of the placement area 221. Both of the protrudingportion 224 and the supporting portion 225 are exposed out of thesurface of the casing 21. When two light emitting chips indifferentcolors from each other are placed on the placement area 221, each lightemitting chip 23 is electrically connected respectively to the positiveand the negative electrode areas 2221, 2222. Since the voltage needed byeach light-emitting chip 23 varies due to different color (e.g., thevoltage for white light, blue light, and green light is approximately at3.0˜3.5V; red light, 1.8˜2.1; and yellow light, 2.0˜2.4V), differentvoltages are respectively applied to both positive and negativeelectrode areas 2221, 2222 depending on the voltage needed by theindividual light emitting chip 23 to prevent affecting the light mixingeffects due to service life decay when improper voltage is applied tothe light emitting chips 23 in different colors.

The prevent invention provides an improved structure of a light emittingdiode, and the application for a utility patent is duly filedaccordingly. However, it is to be noted that the preferred embodimentsdisclosed in the specification and the accompanying drawings are notlimiting the present invention; and that any construction, installation,or characteristics that is same or similar to that of the presentinvention should fall within the scope of the purposes and claims of thepresent invention.

We claim:
 1. A light emitting diode including a non-conductive casingand a conductive frame, the casing defining an accommodation recess toexpose the frame such that two ends of the frame are exposed out of thecasing; the frame comprising a placement area to receive a lightemitting chip and an electrode area separated from the placement area,wherein the placement area has a top surface for receiving the lightemitting chip, a bottom surface spaced apart from the top surface so asto define a first thickness and a pair of protruding portions outwardlyextending from the placement area, respectfully, the protruding portionshaving a second thickness, wherein the first thickness is substantiallygreater than the second thickness such that a step portion is formedadjacent the protruding portions, the step portion being located andconfigured to facilitate the engagement of the placement area with thecasing wherein the light emitting chip is electrically connected to theelectrode area with a conductor, and wherein a packaging polymer isprovided in the accommodation recess.
 2. The light emitting diode asclaimed in claim 1, wherein the first thickness of the placement area isgreater than that of the electrode area.
 3. The light emitting diode asclaimed in claim 1, wherein an opening is formed in the casing to exposethe top surface of the placement area in the accommodation recess andwherein the bottom surface of the placement area is exposed out of thebottom surface of the casing.
 4. The light emitting diode as claimed inclaim 3, wherein the bottom surface of the placement area and the bottomsurface of the casing are on the same plane.
 5. The light emitting diodeas claimed in claim 3, wherein the bottom surface of the placement areaprotrudes from the bottom surface of the casing.
 6. The light emittingdiode as claimed in claim 1, wherein the electrode area is comprised ofone or a plurality of paired positive and negative electrode areas. 7.The light emitting diode of claim 6, wherein each of the positive andnegative electrode areas has a top surface for connection to theconductor and at least one supporting portion extending outside of thecasing.
 8. The light emitting diode as claimed in claim 1, whereinrespective ends of the protruding portions protrude through the casingto expose said ends of the protruding portions outside of the casing. 9.The light emitting diode as claimed in claim 1, wherein respective endsof the protruding portions are exposed outside of the casing through thecasing.